Committee
DPS 2017 » Committee
Committee Chairpersons
- Organizing Committee Chair: Keizo Kinoshita (PETRA)
- Executive Committee Chair: Hiroshi Akatsuka (Tokyo Institute of Technology)
- Program Committee Chair: Miyako Matsui (Hitachi, Ltd.)
- Publication Committee Chair: Kazuhiro Karahashi (Osaka University)
Organizing Committee
| Chair: | K. Kinoshita (PETRA) Japan |
| Vice-chair: | T. Tatsumi (Sony Semiconductor Solutions Corp.) Japan |
| H. Akatsuka (Tokyo Institute of Technology) Japan | |
| N. Fujiwara (Mitsubishi Electric Corp.) Japan | |
| M. Fukasawa (Sony Semiconductor Solutions Corp.) Japan | |
| S. Hamaguchi (Osaka University) Japan | |
| H. Hayashi (Toshiba Corp.) Japan | |
| M. Honda (TOKYO ELECTRON MIYAGI LTD.) Japan | |
| M. Hori (Nagoya University) Japan | |
| T. Ichiki (The University of Tokyo) Japan | |
| T. Ishijima (Kanazawa University) Japan | |
| K. Ishikawa (Nagoya University) Japan | |
| K. Karahashi (Osaka University) Japan | |
| H. Kokura (Samsung Electronics Co., Ltd) Korea | |
| T. Koshizawa (Applied Materials Inc.) USA | |
| M. Matsui (Hitachi, Ltd.) Japan | |
| N. Negishi (Hitachi, Ltd.) Japan | |
| K. Nojiri (Lam Research Corp.) Japan | |
| T. Ohiwa (TOKYO ELECTRON LIMITED) Japan | |
| T. Okumura (Panasonic Corp.) Japan | |
| K. Sasaki (Hokkaido University) Japan | |
| M. Sekine (Nagoya University) Japan |
International Organizing Committee
| A. Agarwal (KLA-Tencor Corp.) USA | |
| W. Boullart (Interuniversity Microelectronics Center-IMEC) Belgium | |
| J. Brcka (Tokyo Electron U.S. Holdings, Inc.) USA | |
| H.Y. Chang (Korea Advanced Institute of Science and Technology) Korea | |
| E-H. Choi (Kwangwoon University) Korea | |
| O. Joubert (LTM/CNRS) France | |
| W.M.M. Kessels (Eindhoven Univ. of Technology) Netherlands | |
| K. C. Leou (National Tsing Hua University) Taiwan | |
| T. Lill (Lam Research Corp.) USA | |
| G. S. Oehrlein (University of Maryland) USA | |
| L. Overzet (University of Texas at Dallas) USA | |
| P. Ventzek (Tokyo Electron U.S. Holdings, Inc.) USA | |
| J.S. Wu (National Chiao Tung University) Taiwan | |
| G-Y. Yeom (Sungkyunkwan University) Korea | |
| S-J. Yoo (NFRI) Korea |
Executive Committee
| Chair: | H. Akatsuka (Tokyo Institute of Technology) Japan |
| Vice-chair: | M. Hori (Nagoya University) Japan |
| Vice-chair: | K. Sasaki (Hokkaido University) Japan |
| T. Hirata (Tokyo City University) Japan | |
| S. Mori (Tokyo Institute of Technology) Japan | |
| T. Nozaki (Tokyo Institute of Technology) Japan | |
| A. Okino (Tokyo Institute of Technology) Japan | |
| N. Takeuchi (Tokyo Institute of Technology) Japan |
Publication Committee
| Chair: | K. Karahashi (Osaka University) Japan |
| Vice-chair: | T. Ishijima (Kanazawa University) Japan |
| Vice-chair: | K. Ishikawa (Nagoya University) Japan |
| T. Ichiki (The University of Tokyo) Japan | |
| K. Eriguchi (Kyoto University) Japan | |
| S. Higashi (Hiroshima University) Japan | |
| K. Kinoshita (PETRA) Japan | |
| N. Kuboi (Sony Semiconductor Solutions Corp.) Japan | |
| H. Kuwano (Tohoku University) Japan | |
| S. Nunomura (Advanced Industrial Science and Technology-AIST) Japan | |
| L. Overzet (University of Texas at Dallas) USA | |
| O. Sakai (University of Shiga Prefecture ) Japan | |
| K. Sasaki (Hokkaido University) Japan | |
| Y. Shimogaki (The University of Tokyo) Japan | |
| M. Shiratani (Kyushu University) Japan | |
| E. Stamate (Technical University of Denmark) Denmark | |
| K. Takahashi (Kyoto Institute of Technology) Japan |
Program Committee
| Chair: | M. Matsui (Hitachi, Ltd.) Japan Japan |
| Vice-chair: | M. Fukasawa (Sony Semiconductor Solution Corp.) Japan |
| Vice-chair: | M. Honda (TOKYO ELECTRON MIYAGI LTD.) |
| J-P. Booth (CNRS/Ecole Polytechnique) France | |
| K-N. Chen (National Chiao Tung University) Taiwan | |
| R. Dussart (CNRS/Université d'Orléans) France | |
| A. Dzarasova (Quantemol Ltd.) UK | |
| D.J. Economou (University of Houston) USA | |
| E. Eriguchi (Kyoto University) Japan | |
| H. Hayashi (Toshiba Corp.) Japan | |
| N. Hayashi (Kyushu University) Japan | |
| T. Hayashi (Nagoya University) Japan | |
| S. Higashi (Hiroshima University) Japan | |
| M. Hiramatsu (Meijo University) Japan | |
| T. Ichiki (The University of Tokyo) Japan | |
| K. Ishikawa (Nagoya University) Japan | |
| S. Y. Kang (Tokyo Electron Ltd.) Japan | |
| K. Karahashi (Osaka University) Japan | |
| Y. Kim (Hynix Semiconductor Inc.) Korea | |
| H. Kobayashi (Hitachi, Ltd.) Japan | |
| K. Koga (Kyushu University) Japan | |
| H. Kokura (Samsung Electronics Co., Ltd.) Korea | |
| H. Kondo (Nagoya University) Japan | |
| A. Koshiishi (Samsung Electronics Co., Ltd.) Korea | |
| T. Koshizawa (Applied Materials Inc.) Japan | |
| N. Kuboi (Sony Semiconductor Solutions Corp.) Japan | |
| S. Kumagai (Toyota Technological Institute) Japan | |
| K. Kurihara (Toshiba Corp.) Belgium | |
| H. Kuwano (Tohoku University) Japan | |
| J-F. de Marneffe (Interuniversity Microelectronics Center-IMEC) Belgium | |
| T. Maruyama (Renesas Electronics Corp.) Japan | |
| S. Miyazaki (Nagoya University) Japan | |
| H. Miyazoe (IBM Corp.) USA | |
| Y. Morikawa (ULVAC Inc.) Japan | |
| M. Morimoto (Hitachi High-Technologies Corp. Taiwan) Taiwan | |
| K. Nakamura (Chubu University) Japan | |
| M. Nakamura (MAMO) Japan | |
| Y. Nakamura (Sony Semiconductor Manufacturing Corp.) Japan | |
| M. Nakatani (Panasonic Corp.) Japan | |
| N. Negishi (Hitachi, Ltd.) Japan | |
| S. Nunomura (Advanced Industrial Science and Technology -AIST) Japan | |
| T. Ohba (Lam Research Corp.) Japan | |
| H. Ohtake (Tokyo Electron Ltd.) USA | |
| T. Okumura (Panasonic Corp.) Japan | |
| F. Roozeboom (Eindhoven University of Technology-TU/e) Netherlands | |
| Y. Sakiyama (Lam Research Corp.) USA | |
| K. Sasaki (Hokkaido University) Japan | |
| M. Sekine (Nagoya University) Japan | |
| Y. Setsuhara (Osaka University) Japan | |
| D. Shamiryan (Mapper) Russia | |
| Y. Shimogaki (The University of Tokyo) Japan | |
| K. Shin (Samsung Electronics Co., Ltd.) Korea | |
| T. Shirafuji (Osaka City University) Japan | |
| M. Shiratani (Kyushu University) Japan | |
| E. Stamate (Technical University of Denmark) Denmark | |
| K. Takahashi (Kyoto Institute of Technology) Japan | |
| M. Terahara (SanDisk Ltd.) Japan | |
| H. Toyoda (Nagoya University) Japan | |
| J. H. A. Um (Samsung Electronics Co., Ltd.) Korea | |
| T. Watanabe (Waseda University) Japan | |
| T. Yagisawa (Toshiba Corp.) Japan | |
| H. Yamauchi (Sharp Corp.) Japan | |
| G-Y. Yeom (Sungkyunkwan University) Korea |
International Advisory Committee
| Chair: | J. Nishizawa (Tohoku University) Japan |
| S. Fujimura (Tokyo Institute of Technology) Japan | |
| R. A. Gottscho (Lam Research Corp.) USA | |
| J-G. Han (Sungkyunkwan University) Korea | |
| Y. Horiike (Tsukuba University) Japan | |
| K. Horioka (Applied Materials Inc.) Japan | |
| M. Izawa (Hitachi High-Technologies Corp.) Japan | |
| T. Makabe (Keio University) Japan | |
| K. Ono (Osaka University) Japan | |
| H. Sugai (Nagoya University) Japan | |
| S. Tachi Japan | |
| K. Tachibana (Kyoto University) Japan | |
| O. Takai (Kanto Gakuin University) Japan | |
| K. Tsujimoto (JST) Japan | |
| M. Yoneda ( ULVAC Inc.) Japan | |
| S. Zaima (Nagoya University) Japan |
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