Poster Program
Poster Session (Friday, Nov. 17)
Poster session is divided into two halves in order to prevent congestion.
At least one of the authors must stay in front of the poster during the assigned Core-Time:
Core-time (1) 11:10 - 12:00 † Odd number
Core-time (2) 12:00 - 12:50 ‡ Even number
Etching Technology
†P-1 E. Prevost
Study of very high selective downstream plasma etching mechanisms, for high aspect ratio patterns
‡P-2 H. S. Lee
A study on the etch characteristics and environmental effects of Ar/C3F6O gas chemistry
†P-3 T. Hayashi
Dissociative properties of 1,1,1,2-tetrafluoroethane (HFC-134a) obtained using computational chemistry
‡P-4 Y. Osada
Damage evaluation by High selective dry etching of GaN over AlGaN
†P-5 C.-Y. Hsu
Damage Reduction towards Plasma Etching of Low-k Dielectrics with New Chemistries
‡P-6 A. Matsutani
Profile Control in Si Etching by Two-step Etching Process Using XeF2 Vapor for Fabrication of Concave Micromirror
†P-7 H. Li
Etching mechanisms of ITO by low energy hydrocarbon ions
‡P-8 T. Sasaki
Ag film etching by halogen gas plasma
Manufacturing Technology (AEC, APC, EES, FDC)
†P-9 M. K. Ramos
Optical Characterization of Amorphous Carbon Deposited via Low-Energy Ions
Surface Reaction and Damage
‡P-10 R. Tahara
Fabrication of dense yttrium oxyfluoride ceramics by hot-pressing and their electrical properties
†P-11 T. Tsunoura
Sintering behavior of yttrium oxyfluoride (Y5O4F7) ceramics
‡P-12 T. Yamamoto
Oxidation of GaN surface by remote oxygen plasma
†P-13 T. Kuyama
Characterization technique of silicon nitride film damaged by plasma exposure
‡P-14 K. Han
Chamber condition control to improve reproducibility of plasma etch processes
†P-15 N. Kamata
The Effect of Deterioration Time on Modified Polyethylene Naphthalate Films by Low-pressure
High-frequency Plasma Chemical Vapor Deposition Method
Plasma Diagnostics and Monitoring System
‡P-16 A.G. Cuevas
Characteristics of Ar/C2H2 plasma for low-energy ion beam extraction and deposition of amorphous carbon films
†P-17 Y. Yamashita
Excitation-kinetic model for argon processing plasma diagnostics by optical emission spectroscopic measurement based on collisional-radiative model
‡P-18 M. Hotta
Application of curling probe to in situ monitoring of thin layer deposited on chamber wall
†P-19 K. J. Jo
Optical Monitoring of Plasma Condition for a Comparison Study of RF Generators
‡P-20 G. J Kang
In-Situ Monitoring and Analysis of NF3 Remote Plasma Chamber Cleaning
†P-21 K. Koga
Development of a fine particle transport analyzer for processing plasmas
‡P-22 M. H. Lee
Silicon Photonics Devices for the Consideration of Plasma Uniformity Monitoring Sensor
†P-23 T. Tsutsumi
A Behavior of negative ions in asymmetric capacitively coupled plasma discharge produced in Ar/O2/C4F8 gas mixture at 100 MHz
‡P-24 A. Ando
Characterization of arc plasma for syntheses of highly crystalline single-walled carbon nanotubes (SWNTs)
Modeling and Simulation
†P-25 T. Shirafuji
Helmholtz equation for representing a potential profile in a weakly collisional quasi-neutral presheath
‡P-26 M. Moriyama
Influence of capacitive coupling on the sheath of inductively coupled plasma for material processing
†P-27 S. Tinck
Cryogenic etching of porous SiO2 with SF6/O2 plasmas
‡P-28 L. -W. Su
Two dimensional simulations of triode VHF SiH4 plasma
†P-29 S. Rahimi
Numerical Simulation of BOSCH Process Using Chemistry Data from QDB
‡P-30 S. Kawaguchi
Electron collision cross section set of c-C4F8 gas
†P-31 N. A. Mauchamp
Collision Cascade Dynamics for Self-Sputtering of Lennard-Jones Atoms
‡P-32 H. Choi
Simulation Enhanced Optimization for By-product Removal During Etch Process
Plasma Generation (Equipment/Source)
†P-33 K. Ogiwara
New large-area plasma source using double-ridge waveguide
‡P-34 N. Kamata
Optical emission spectroscopy observation of photoemission- assisted plasma ion source for Surface flattening
†P-35 M. Shimabayashi
Effect of discharge tube temperature on the densities of N(4So) and N2(A3Σu+) in a remote nitrogen plasma
‡P-36 Y. Ohtsu
Ring-Shaped Plasma for Target Utilization in Specific Area by HiPIMS Source
†P-37 Md. A. A. Mamun
A high frequency pulsed-DC power supply for capacitive coupled plasma CVD of DLC films
‡P-38 K. Shibata
Characteristics of 150 kHz band high-power burst inductively coupled plasma
Deposition Technologies(CVD/PVD)
†P-39 H. Kawasaki
Preparation of several kinds of elements mixed thin films by plasma process using powder targets II
‡P-40 T. Ohshima
Investigation on sputtering film deposition using powder target
†P-41 C.-W. Lin
NiO thin-film transistor with tetragonal HfO2 gate insulator
‡P-42 N. Promros
Surface Morphology and Wettability of NC-FeSi2 Thin Films Created by Facing-Target Direct-Current Sputtering
†P-43 S. Hashimoto
Photoemission-assisted plasma CVD growth of N-doped diamond like carbon films on Si substrates
‡P-44 K. Yuzurihara
Electrical properties of RF magnetron sputtered Al-doped ZnO thin films and their dependence on radial substrate position
†P-45 T. Kimura
Preparation of TiN films by reactive high power pulsed sputter Penning-type discharges
‡P-46 K. Takenaka
Formation of c-axis Orientated AlN Films Using ICP-enhanced Reactive DC-pulsed Sputtering
†P-47 N. Y. Sato
Plasma effect on the sheet resistance reduction of ZnO transparent conductive film
‡P-48 H. Himura
Properties of ZnO thin film produced by intermittent RF oxygen plasma source
†P-49 Y. Setsuhara
Low-Temperature Formation of High-Mobility IGZO Thin Film Transistors Using ICP-Enhanced Reactive Plasma Processes
‡P-50 T. Maruko
Effects of pulse frequency and duty cycle on synthesis of carbon nitride using pulse microwave plasma CVD
†P-51 M. Takahashi
Influence of pulse width on DLC films deposited by HiPIMS
‡P-52 H. Sugiura
Effects of residence time on dissociation of precursors at deposition of amorphous carbon film by H2/CH4 plasma
†P-53 Y. Inoue
In-situ measurement of IR spectra during SiO:CH deposition by remote-type ICP-CVD
‡P-54 K. Ichikawa
Thermal chemical vapor deposition graphene directly synthesized on the nickel oxide film
†P-55 K. Saito
Fabrication of boron-doped diamond films on cemented tungsten carbide
Plasma Processes for New Material Devices (MRAM, Power, Organic)
†P-57 D. Ogawa
Investigation of Isocyanate Groups Functionalized After Plasma-Treatment by Focusing on Size of Multi-Walled Carbon Nanotubes
‡P-58 S. Murakami
Etching characteristics of TPCO in O2/Ar plasma
Plasma Processes for Biological and Medical Application, MEMS
†P-59 G.V. Latag
Effect of Plasma Modification on Electrospun Chitosan/ Poly(ε-caprolactone) Nanofiber Mats
‡P-60 K. Matsumoto
Effect of Reducing Active Species in Hydrogen Plasma on Plant Growth
†P-61 R. Ono
Identification of mechanism of callus growth enhancement by active species generated by DBD plasma
‡P-62 K. Yamamoto
Ozone Concentration Effect on Sterilization of Fruit Surface Irradiated by Atmospheric Air Plasma
†P-63 Y.-S. Liao
Growth Enhancement Mechanism of Plants Induced by Oxidation Effect of Active Species in Plasma
‡P-64 R. Ichiki
Investigation on Hard-Tissue Compatibility of TiN Surface formed by Atmospheric-Pressure-Plasma Nitriding
‡P-66 S. Kitazaki
Chromaticity characterization of effects of atmospheric pressure plasma irradiation on skin of hairless mice
Atmospheric Pressure Plasma and Liquid Plasma
†P-67 H. Suzuki
Influence of Air Gas Flow Rate on Photoresist Removal Characteristic in Microwave Excited Plasma using Water Vapor
‡P-68 J.-S. Oh
Spatial distribution of ionic species in plasma plume of an atmospheric pressure He plasma jet
†P-69 H. Akamatsu
Metal organic plasma decomposition for synthesis of metal oxide thin film at low temperature
‡P-70 Y.-C. Sung
Silicon Etching of Difluoromethane Atmospheric Pressure Plasma Jet combined with Its Spectroscopic Analysis
†P-71 K. Kajikawa
Fabrication of fuel cell electrocatalytic layer using nanographene synthesized by in-liquid plasma
‡P-72 H. Suzuki
Power Absorption Mechanism of Atmospheric Pressure Microwave Line Plasma
†P-73 K. Yambe
Determination of Gas Flow Channel from Plasma Light Emission in Atmospheric-Pressure Non-Equilibrium Plasma
‡P-74 K. Ogawa
Extension of Atmospheric Pressure Plasma Length using Sheath Air Flow for Wrapping Core He Jet
†P-75 M. Maeyama
Examination of generated excited species and degradation reactions in waste water treatment using ball lightning like discharges
New Dry Process Concepts
‡P-76 K. Hashimoto
Effects of Streamer Corona Discharges on Electrospray Deposition on Insulator Substrates
†P-77 M.S.D.C. Dela Vega
Gram-scale Production of Functionalized Multi-layered Graphene as Cement Reinforcement
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