Poster Program
Poster Session (Tuesday, Nov. 22)
Poster session is divided into two halves in order to prevent congestion.
At least one of the authors must stay in front of the poster during the assigned Core-Time:
Core-time (1) 10:10 -11:00 † Odd number
Core-time (2) 11:00 -11:50 ‡ Even number
Etching Technology
†P-1 H. Omori
Etching Property of C3HXF(6-X)
‡P-2 P. Shen
Silicon etching with reduced RIE-lag
†P-3 E. Laudrel
Chlorine-based plasma deep etching of bulk titanium
‡P-4 T. Kawahara
Plasma process for the improvements of device characteristics for self-aligned nano-carbon FETs
†P-5 L. Hsu
Tri-layer metal hard mask etch defect control by a novel molecule radical during in-situ chamber clean
‡P-6 T. Tillocher
Enhanced reproducibility of SiO2 Atomic Layer Etching by addition of O2 steps
†P-7 K.C. Yang
Etch characteristics of SiO2 using pulsed capacitively coupled plasmas
‡P-8 T. Hayashi
Unveiling aspects of alternative refrigerants involving HFO-1234ze from computational chemistry
†P-9 B. J. Lee
Etching Characteristics and Mechanisms of MoS2 in Cl2/Ar Inductively Coupled Plasma
‡P-10 J.Y. Lee
Study on Etch Characteristics of CoFeB thin films with Nanometer-Sized Patterns using Pulse-Time Modulated Plasma
†P-11 S. M. Hwang
Etch characteristics comparison of nanometer scale TiN hard masked MTJ stacks etched in a constant wave and pulse modulated plasma
‡P-12 H. Li
Mechanisms of chemically enhanced etching of ZnO by hydrocarbon plasma
Manufacturing Technology (AEC, APC, EES, FDC)
†P-13 Y. Kasashima
Development and evaluation of magnesium oxide based ceramics for chamber parts in mass-production plasma etching equipment
†P-15 S. J. Hong
Improved In-Situ Plasma Chamber Monitoring Performance in Self Plasma-Optical Emission Spectroscopy
Surface Reaction and Damage
‡P-16 Y. Nakano
Electrical damage in n-GaN films treated by CF4 plasma
†P-17 G. Kuroda
The outermost surface of Si observed in Ar/CF4 plasma etching
‡P-18 T. Tsunoura
Fabrication and fluorine plasma irradiation behavior of YOF ceramics
†P-19 T. Takami
Plasma surface process of cubic boron nitride studied by using microscopic single crystals
‡P-20 K. Nishida
An optical model for in-line analysis of plasma-induced interlayer dielectric damage
†P-21 T. Higuchi
Defect profiling of plasma-damaged layer by surface-controlled photoreflectance spectroscopy
‡P-22 Y. Banno
Damage Evolution of Gallium Nitride in Argon-Chlorine Plasma
†P-23 J. Lee
A comparative study of fluorocarbon etching residue formation by CF4/C4F8/Ar and CF4/CH2F2/Ar plasmas
‡P-24 K. Karahashi
Surface reactions of amorphous carbon layers by argon and fluorocarbon ion beams
Plasma Diagnostics and Monitoring System
†P-25 D. Ogawa
Analysis of miniaturized curling probe
‡P-26 J-S Oh
Ambient Mass Spectrometric Investigation of Atomic Oxygen Radicals in Afterglow Plasma
†P-27 J-S Oh
Investigating High Quality Ozone Generation using UV Absorption Spectroscopy and Ambient Mass Spectrometry
‡P-28 H. Toyoda
Evaluation of O- Ion Flux in a VHF-DC Magnetron Plasma under ITO Sputtering Process
Modeling and Simulation
†P-29 R. Sugano
Molecular dynamics simulation of surface reactions in atomic layer etching of Si3N4
‡P-30 H. Tan
Spectroscopic Study on Chemical Kinetics of NO (A, B, C) States in Low- pressure N2-O2 Microwave Discharge
†P-31 S. Kawaguchi
Electron collision cross section set of SiF4 gas
‡P-32 P. Moroz
Feature Profile Simulation of Silicon Nitride Atomic Layer Deposition
†P-33 L. Tong
Numerical investigation of an atmospheric pressure RF dielectric-barrier discharge operating in the α and γ modes
‡P-34 S. Rahimi
Constructing self-consistent validated plasma chemistry
Plasma Generation (Equipment/Source)
†P-35 T. Tsuchiya
Generation of High Pressure Laser Sustained Argon Plasma using CW Diode Laser
‡P-36 K. Nishimoto
New technique for large-area plasma generation using double-ridge waveguide
CVD/PVD/ALD
‡P-38 C. Huang
Surface Characterization of the Organosilicon Films by Low Temperature Atmospheric-Pressure Plasma Jet
†P-39 H. Kawasaki
Preparation of several kinds of elements mixed thin films by plasma process using powder targets
‡P-40 T. Betsuin
Monocrystalline Diamond Growth by Irradiation of Ar Inductively Coupled Thermal Plasma with CH4/H2 Gas Injection near the Substrate
†P-41 Y. Setsuhara
Combinatorial characterization of a-IGZO film properties deposited with ICP-enhanced reactive sputtering
‡P-42 H. Suzuki
Plasma-enhanced chemical vapor deposition of SiO2 films by slot type microwave plasma with O2/TEOS
†P-43 Y. Suda
Preparation of functional thin films by backside irradiation pulsed laser deposition using powder targets
‡P-44 S-W Han
Growth of ZnO Nanorods and films on SrTiO3 and LaAlO3 Substrates
‡P-46 A. Nopparuchikun
C-V-f and G-V-f Characteristics of n-Type β-FeSi2/p-Type Si Heterojunctions Fabricated by Using Radio Frequency Magnetron Sputtering
†P-47 K. Akiyama
MOCVD growth of photoluminescent iron disilicide via vapor-liquid-solid method using Au-Si liquids phase
‡P-48 S. Takai
Growth of InN at a low-temperature by radical enhanced chemical vapor deposition
†P-49 M. Tomatsu
Hydrogen peroxide sensor based on carbon nanowalls grown by plasma enhanced chemical vapor deposition
‡P-50 K. Hattori
Influence of substrate bias voltage on heat influx to substrate in high power impulse magnetron sputtering
†P-51 Y. Matsuda
Uniform deposition of Al-doped ZnO films on off-axis inclined substrates by using RF magnetron sputtering
Plasma Processes for New Material Devices (MRAM, Power, Organic)
‡P-52 S. W. Park
Magnetic tunneling junction material etching using He
†P-53 K. Matsuo
High-accuracy etching process of polyimide for organic film devices using ICP system
‡P-54 T. Ohshima
The proton conducting single chamber SOFC prepared by RF magnetron sputteringC
†P-69 K. Hosomi
Plasma-induced Improvement in Organic Vapor Sensitivity of Tarnished Ag Nanoparticles
Plasma Processes for Biological and Medical Application, MEMS
†P-55 R. Nakano
Inheritance of plant growth enhancement effect induced by active species in oxygen plasma
‡P-56 Y. Fukuhara
Freshness keeping and antioxidative activity of agricultural products irradiated by atmospheric air plasma
†P-57 K. Mine
Inactivation effect of active species generated by DBD on oral cancer cell
‡P-58 T. Yamada
Treatment of hard-degradable protein using low-pressure RF oxygen plasma
†P-59 S. Miura
Sterilization characteristics of catheter interior of narrow tube using oxygen RF plasma
‡P-60 K. Matsumoto
Plant growth enhancement using active species in water plasma
†P-61 A.F.M.Mella
Surface properties of PVC endotracheal tubes by argon plasma etching
Atmospheric Pressure Plasma and Liquid Plasma
‡P-62 T. Kitano
Spectroscopic Investigations in Photoresist Removal Process using Microwave Plasma in Water Vapor
†P-63 H. Akamatsu
Dispersion of zinc oxide fine particles in liquid with atmospheric pressure plasma jet irradiation
‡P-64 M. Shinohara
Infrared spectroscopic study of the reactions between an octadecyltrichlorosilane self-assembled monolayer and plasma generated in H2O2 solution
†P-65 M. Mardis
Synthesis Metal-Carbon Nanoparticles by Laser Ablation under Pressurized CO2
‡P-66 T. Shirafuji
Reaction mechanisms of methylene-blue degradation in three-dimensionally integrated micro solution plasma
†P-67 K. Okamura
One-dimensional simulation of atmospheric-pressure dc glow discharge in He/H2O
New Dry Process Concepts
‡P-68 H. Yamamoto
Fabrication of High Aspect Ratio Nanostructure by Using ClF3-Ar Neutral Cluster Etching
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