Poster Session
Presentation guideline
Poster session is divided into two halves in order to prevent congestion.
At least one of the authors must stay in front of the poster during the assigned Core-Time:
Core-time (Part 1) 18:40 – 20:00 JST, Thursday, November 24, 2022 ‡ Even number
Core-time (Part 2) 8:30 – 9:50 JST, Friday, November. 25, 2022 † Odd number
Etching Technology
- †P-1 M. Hada
Etch Rate and Uniformity Prediction Using Laser Absorption Spectroscopy
- ‡P-2 Y. Ikeda
Feedforward temperature control and failure prediction technologies for intelligent subsystems
- †P-3 M. Morimoto
Effects of time-modulation bias on polysilicon gate etching
Manufacturing Technologies (AEC, APC, EES, FDC)
- ‡P-4 H. Kato
Generation of Reactive Atmospheric-Pressure Micro-Thermal-Plasma-Jet and Its Application to Organic Film Etching
Surface Reaction and Damage
- †P-5 S. Taira
Etching reactions of high energy ions with SiO2/SiN nano-scale multi-layers
Plasma Diagnostics and Monitoring Systems
- ‡P-6 Y. Yamashita
Diagnosis of argon inductively coupled plasma by optical emission spectroscopic measurement with compensation of spectral reflectance on chamber inner wall
- †P-7 M. Niimoto
Experimental test of passively determining three-dimensional distributions of reactive species contained in surface wave plasmas
- ‡P-8 H. Matsuura
Calorimetric measurement of reactive species amount and surface reaction of plasma irradiated target
- †P-9 Y. Seki
Time-resolved measurement of ion composition in a dual-frequency capacitively-coupled pulsed plasma
- ‡P-10 Y. Lee
Developed technology for thickness and process diagnosis sensor to improve the reliability of nano-etching
- †P-11 K. Masuda
Spatial distribution of hydrogen atom density above stainless-steel surface in inductively coupled remote H2 plasma measured by vacuum ultraviolet absorption spectroscopy
- ‡P-12 N. Britun
Plasma diagnostics of the F and O radical density in dual-frequency capacitively coupled discharges with CF4/H2
Computational Approaches (Modeling, Simulation, Machine Learning, AI, Informatics, DX) for Dry Process
- †P-13 Z. R. Ma
Comparison of powderizations of uranium dioxide solid by non-equilibrium plasma oxidation and thermochemical oxidation for actinide analysis
- ‡P-14 Y. Shimamura
Nano-Pixel Power-Splitter and High-Mesa Sensing Waveguides Integration using Two Step Dry-etching
- †P-15 T. Yang
Predicting Device Shapes and Structures via Ellipsometry Spectra from GPU Accelerated Finite Difference Time Domain Simulation.
- ‡P-16 I. Nagao
One-dimensional particle-in-cell / Monte Carlo collision model simulation of the effects of amplitude modulation discharge on ion/electron energy distribution functions
Plasma Generation (Equipment/Source)
- †P-17 T. Anan
Effects of plasma activ ated lact ate solution administration to seeds of Arabidopsis thaliana on germination characteristics
- ‡P-18 Y. Ohtsu
Spatial structures of rf ring-shaped magnetized sputtering plasma with two facing cylindrical ZnO/Al2O3 targets
- †P-19 H. Himura
Development of negative ion source using microwave plasma
Deposition Technologies (CVD / PVD)
- ‡P-20 L. V. Minh
An edge-type ionic liquid ion source with the flow-feeding microfluidic channels
- †P-21 S. Kato
Study for a Sharp Resonant Spectrum from Curling Probe
- ‡P-22 J. W. Hong
Effect of Various Pulse Plasma Techniques on TiO2 Etching
- †P-23 H. Kawasaki
Elemental gradient functional thin film production for hydrogen entry prevention using NiO powder target
- ‡P-24 K. Takenaka
Development of Plasma-Assisted Reactive Process for Large-Area Uniform Formation of High Mobility IGZO Thin-Film Transistors
- †P-25 S. Kaneko
Lattice constants of Ionic crystal with point defects ~simulation and experiment on MgO crystal~
- ‡P-26 J. Kito
Development of DC Vacuum Arc Deposition Systemwith Anode Generating Magnetic Field and Preparation of TiN Film
- †P-27 T. Magata
CVD Synthesis of Vertical Nanowire Thin Film of Reduced Niobium Oxide and the Electrocatalytic Performance Assessment
- ‡P-28 H. Kunieda
Gas phase diagnostics on high power pulsed magnetron sputtering using double-pulse target voltage for deposition of diamond like carbon
- †P-29 K. Akiyama
Luminescent Epitaxial β-FeSi2 Film Growth by MOCVD
- ‡P-30 H. Kobayashi
Investigation of post treatment with atmospheric pressure plasma on metal oxide thin films deposited by mist CVD
- †P-31 W. Yasuda
Crystalline Phase Control of Hf-oxide Layer due to Si Surface Orientations
Atomic Layer Processes (ALD/ALE)
- ‡P-32 Y. Jang
Plasma Information Variables Based on Ion Dynamics in Collisional RF Sheath for Etching Profile Monitoring
- ‡P-54 A. Osonio
Isotropic Plasma-enhanced Atomic Layer Etching of SiO2 using F radicals and Ar plasma
Dry process for Green Transformation:GX (Energy saving technology, Alternative gas, 3D-IC/Packaging)
- ‡P-34 T. Matsumoto
Polyethylene Glycol Doping Effects on Photocatalytic Activity of Anatase/Rutile-Mixed Phase TiO2 Nanoparticles
- †P-35 S. Endo
Consideration of Reaction Mechanism by Calculation of Behavior of Oxygen Active Species in Photodesmear® Method
- ‡P-36 S. Toko
Effect of H2O capture in methanation with plasma catalysis
Plasma Processes for New Material Devices (MRAM, Power, Organic)
- †P-37 Y. Miyatake
Flexible VO2 films with insulator-metal transition grown on polyimide films
Plasma Processes for Biological and Medical application, MEMS
- ‡P-38 N. Hayashi
Changes in molecules on the seed surface due to oxygen plasma irradiation
- †P-39 S. Ahmed
Increased yield of medicinal plants by low pressure plasma irradiation of seeds
Atmospheric Pressure Plasma and Liquid Plasma
- ‡P-40 H. Woo Tak
Effect of CxHyFz Isomer Branch Structure on High Aspect Ratio Etching
- ‡P-42 T. Shimosaka
Fundamental Study on Decladding of Silicon Carbide Layer in TRISO Fuel by Using Non-Equilibrium Plasma Reactor
- †P-43 D. Kashiwagi
Novel CVD process using solution raw materials
- ‡P-44 T. Shirafuji
Influence of the Initial Space Charges on the Dynamics of Surface-Launched Plasma Bullets
- †P-45 K. Z. PHYO
Optical Wave Microphone Measurement of Pressure Wave Generated During Plasma Formation
- ‡P-46 T. Matsumura
Effects of Quasi-Atmospheric-Pressure Low-Temperature Air Plasma Jet Irradiation on Increasing Minerals in Fresh Food
- †P-47 Y. Makino
Atmospheric-Pressure Low-Temperature O2 Plasma-Assisted Annealing on Visible-Light-Induced Photocatalytic Activity of Pt-doped Rutile TiO2 Nanoparticles
- ‡P-48 K. Nomoto
Damage-Less Microbial Inactivation of Plant Nutrient Solutions Irradiated with Atmospheric-Pressure Low-Temperature Air Plasma Jets
New Dry Process Concepts
- †P-49 I. Ohyama
Repetition Frequency Fluctuation due to Interaction between Cold Plasma and Metal Conductor under Atmospheric Pressure
- ‡P-50 J. R. Vella
Unraveling Plasma-Surface Interactions Through Molecular Dynamics Simulations
- †P-51 E. Kang
Research on HBP-ALE (High boiling point atomic layer etching) source technology and surface reaction mechanism using Fluorocarbon-based alternative gas
- ‡P-52 T. Seki
GaN etching with reactive gas cluster injection
- †P-53 H. Kawasaki
Transition Metal Doping of Calcium Carbonate Whisker for Photothermal Application