Poster Session
Presentation guideline
Poster session is divided into two halves in order to prevent congestion.
At least one of the authors must stay in front of the poster during the assigned Core-Time:
Core-time (1) 10:40 -11:40 † Odd numbers
Core-time (2) 11:40 -12:40 ‡ Even numbers
Etching Technology
- †P-1 Yudai Akatsukai
Influence of Ion Incident Energy on Charge Accumulation at the Bottom of High Aspect Ratio Holes in Dual-Frequency Capacitively-Coupled Plasma
- ‡P-2 Jia He
Etching of GaN using Ar/F2 plasma at high temperatures
- †P-3 Yuki Tatsumi
In-plane tilting control of memory hole etching in Bi-frequency CCP plasma
- ‡P-4 Sangbae Lee
Plasma Etching of Silicon Boride Hard Mask using Fluorocarbon and Nitrogen Tetrafluoride Gases
- †P-5 Eunsu Lee
High Aspect Ratio Etching of SiO2 at Low-Temperature using Low-Global Warming C3H2F6
- †P-7 KyoungChan Kim
Enhancing the Etch Characteristics of Magnetic Tunnel Junction (MTJ) Layers through RF-Biased RIBE
- ‡P-8 Kyung Lim Kim
ON multilayer etch without mask using C4H2F6 - based gas
- †P-9 Tran Trung Nguyen
Hydrofluoroethane plasmas with CHF2CF3, CF3CH3, and CHF2CH3 on reactions of etching surface of SiN, SiO2 and poly-Si films
- ‡P-10 Woo Chang Park
Highly selective dry etching of SiGe using NF3 -based remote plasma
Manufacturing Technologies (AEC, APC, EES, FDC)
- †P-13 Hidenobu Tochigi
Improving Semiconductor Process Monitoring: Structural Innovations in Sapphire-Based Capacitance Manometers
Surface Reaction and Damage
- ‡P-14 Shota Nunomura
CF4 plasma etching-induced defects at SiO2/Si interface
- †P-15 Takuma Yanagisawa
Ruthenium (Ru) etching by energetic reactive ions
- ‡P-16 Kotaro Ozaki
Study on Selective Dry Etching of Epitaxially Grown Si0.7Ge0.3 and Si using H2 Diluted CF4 Plasma
- †P-17 Hee Yeon Noh
Analysis of Hydrogen Migration Mechanism and Electrical properties in InGaZnO through Plasma Deposited thin films
- ‡P-18 Ryoto Takahashi
UV laser ionization desorption of surfaces for GaN etching
- †P-19 Shinichi Endo
Surface reactions of silicon compounds by VUV-Reduction and VUV-Redox using a xenon excimer lamp
Plasma Diagnostics and Monitoring Systems
- ‡P-20 Junyeob Lee
Development of a polymer sensor capable of diagnosing chamber contamination during the process
- †P-21 Myeong Seok Seo
Etch characteristics of SiO2 for C4F8/C4F6/Ar/O2 Gas Mixture in Triple-frequency Capacitively Coupled Plasma
- ‡P-22 Hwang Gyu Kim
Impedance Monitoring of Chamber Contamination in PECVD equipment
- †P-23 Zoltan Donko
The effect of N2 addition to Ar gas on the Ar 2p→1s spectral line intensities in a capacitively coupled plasma
- ‡P-24 Hiroshi Akatsuka
Optical Emission Spectroscopic Measurement of Electron Temperature and Density of Oxygen ICP
- †P-25 Yun Seong Cho
Non-invasive Wall Sheath Diagnostic Method in 300mm Plasma Etching Chamber
- †P-27 Shohei Nanya
Measurement of surface reactions of hydrogen atoms on substrates irradiated by H2 inductively coupled plasma
- ‡P-28 Kakuto Watanabe
Effect of Electron Density of Low-temperature Plasma for Functionalization of Multi-walled Carbon Nanotube
- †P-29 Shiro Matsumoto
Behavior of ions on carbon-HiPIMS using various noble gases
- ‡P-30 Andrey Ushakov
Measurements of ion fluxes and photomasks surface degradation to study etch effects in nanolithography applications in low-density H2-plasma
Computational Approaches (Modeling, Simulation, Machine Learning, AI, Informatics, DX) for Dry Process
- †P-31 Aulia Sukma Hutama
Kinetic modeling of plasma fluorination on pyrene and coronene as graphene models
- ‡P-32 Kazuki Denpoh
Effects of ionization by Ar+ on Ar CCP simulated using GPU-PIC with DNT+DM
- †P-33 Kosuke Yamamoto
Structural modification of Ti surfaces via low-energy hydrogen ion irradiation for plasma-enhanced atomic layer processes
- ‡P-34 Jin Seok Kim
PiCHY: A GPU Parallelized PIC-MCC Simulator for Actual 300 mm Reactor
- †P-35 Juan P. Barberena-Valencia
Improved fidelity of a zero-dimensional model of a capacitively coupled plasma reactor through uncertainty quantification and sensitivity analysis
- ‡P-36 Haruka Nakano
Similarity law of surface-wave sustained plasma columns deduced from two-dimensional self-consistent modeling
- †P-37 Yuan-Ming Chiu
Precise Ion Energy Distribution Control in ECR Plasma by Using Bias Voltage Waveform Tailoring
- ‡P-38 Nicolas Mauchamp
Cryogenic etching of SiO2 surfaces by HF plasmas using MD simulations
- †P-39 Ji Hyun Shin
Analysis of phase-resolved ion dynamics in a pulsed RF capacitively coupled plasma using a two-dimensional particle-in-cell simulation
- ‡P-40 Tomoyuki Murakami
Statistical analysis of complex chemical reaction networks in low-temperature plasmas
- †P-41 Hwan Ho Kim
Two-dimensional particle-in-cell simulation of argon chlorine discharge in capacitively coupled plasma
- †P-43 Makoto Sato
Reaction analysis of allyl-Co(CO)3 precursors with Si substrates by using universal machine learning potential
Plasma Generation (Equipment/Source)
- ‡P-44 Keren Lin
Development and Measurement of a Gas Temperature Controllable Atmospheric-Pressure Plasma Jet System for Plasma Bio Research
- †P-45 Md Hasibul Islam
Impact of like-pole-aligned hybrid MCMF on hydrogen plasma density inside a low-pressure RF driven CCP discharge with a hollow cathode
- ‡P-46 Yasunori Ohtsu
Production of a hybrid RF capacitively and inductively coupled plasma using CH4 and H2 mixture gases for preparing carbon nanostructures
- †P-47 Laxminarayan L. Raja
Computational modelling of a 1-D pulsed argon capacitively coupled plasma discharge to identify different heating mechanisms
- ‡P-48 Keishi Yanai
Nitrogen gas discharge microplasmas generated with a micro-hollow electrode embedded in the ceramic insulator into an open-ambient air
Deposition Technologies (CVD / PVD)
- †P-49 Yutaka Kusuda
Low temperature deposition of SiO2 by Plasma Enhanced CVD using SiH4 or TEOS
- ‡P-50 Futa Shiga
Controlled synthesis of Wadsley-Ross phase Nb oxide nanowires using a CVD process
- †P-51 Shinjiro Ono
Effects of molecular structure of hydrocarbons on deposition characteristics of a-C:H films using plasma CVD
- ‡P-52 Takeru Okada
Formation of ZnWO4/WO3 Composite by RF Magnetron Sputtering
- †P-53 Jiseok Lee
Understanding Wall Deposited Thin Film of Plasma Deposition Equipment for the In Situ Dry-Cleaning
- ‡P-54 Yuto Oishi
PVD and CVD hybrid method with High Power Pulsed Sputtering (HPPS) Plasma for carbon film deposition
- †P-55 Masanori Shinohara
Film deposition process during PECVD using organosilane as a source
- ‡P-56 Kosuke Takenaka
Evaluation of Stability and Electronic Gap States of Amorphous In-Ga-Zn-Ox Thin Film Transistors
- †P-57 Yuta Saito
Low temperature deposition of tin dioxide on PEN substrate using high-power pulsed magnetron sputtering
- ‡P-58 Yuya Asamoto
Effect of low-energy ion irradiation during deposition on dielectric breakdown of hexagonal boron nitride films
- †P-59 Jun Tanaka
Plasma deposition process of Niobium thin films for ULSI interconnect
- ‡P-60 Chiyun Bang
Evaluation of Sputtering Seed Layer Using RF and DC Magnetron Sources in High Aspect Ratio TSV Process
- †P-61 Ying Hung Chen
Enhanced Conformal-type Electromagnetic Shielding by High Power Impulse Magnetron Sputter deposited Copper
- ‡P-62 Takayuki Ohta
Deposition of InGaZnO film using high power impulse magnetron sputtering
- †P-63 Naoyuki Sato
Generation of Ca-Mg-Zn-Ar Mixture Plasma by Inductively Coupled Discharge
- ‡P-64 Ping-Yen Hsieh
Improved plasma etching resistance of focus ring by applying gas flow sputtered SiC coating
Atomic Layer Processes (ALD/ALE)
- †P-65 Taeseok Jung
Plasma-Enhanced Atomic Layer Etching of Si3N4 at Low Temperature using Trifluoromethane
- †P-67 Ju Young Kim
Comparative study of inductively coupled plasma system and ion beam system for Ru atomic layer etching
- †P-69 Noboru Sato
Estimation of Vapor Pressures of Metal Organic Complexes using modified COSMO-SAC method
- ‡P-70 Madjid Adjabi
Cryogenic Atomic layer Etching of p-Si in fluorine based plasmas
Dry process for Green Transformation:GX (Energy saving technology, Alternative gas, 3D-IC/Packaging)
- †P-71 Kotaro Kunimoto
Photocatalytic Characteristics of ZnO Nanoparticles Annealed with Chitosan and Citric Acid at a Low Temperature in Al foil-Shield Combustion Boats
- ‡P-72 Itsuki Soga
Vanadium Enables Suppression of Energy Input and Greenhouse Gas Emission for Solid-State Synthesis of Niobium Carbide Electrocatalyst
Plasma Processes for New Material Devices (MRAM, Power, Organic, III-V, 2D)
- †P-73 Hyeon-Jun Lee
Advanced techniques in plasma-assisted hydrogen implantation for oxide semiconductors and its analysis of thermal reflectivity
Plasma Processes for Biological and Medical application, MEMS
- ‡P-74 Kazunori Koga
Multi-year reproducibility of sugarcane growth promotion effect by administration of air plasma-irradiated leaf mold
Atmospheric Pressure Plasma and Liquid Plasma
- †P-75 Hayate Tanaka
Observation of Plasma-Induced Albumin Aggregation Using a High-Speed Camera
- ‡P-76 Chun Huang
Induced Grafted Polymerization of a Carboxyl-Rich Poly (acrylic acid) Layer on PTFE Using Helix Atmospheric Pressure Plasma
New Dry Process Concepts
- †P-77 Akihiro Shimizu
Effects of Vacuum Ultraviolet Irradiation and Oxygen Plasma Treatment as Pretreatment on Interface Structure between Copper Seed Layer and Cycloolefin Polymer Film
- ‡P-78 Koshi Kato
Suitability evaluation of DC arc plasma treated WC-Co granulated powder for laser based additive manufacturing
- †P-79 Hirotomo Itagaki
Property improvement of granulated WC-Ni powder by DC-Arc plasma treatment